Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Filler materials : the current situation and future trends with particular reference to lead-free soldering alloysZACCARIA, B.Welding international. 2001, Vol 15, Num 7, pp 545-550, issn 0950-7116Article

Determining solder alloy and base metal compatibilitySHAPIRO, Alexander E.Welding journal. 2007, Vol 86, Num 9, pp 33-34, issn 0043-2296, 2 p.Article

Lead-Free Solders and Materials Issues in Microelectronic PackagingJournal of electronic materials. 2002, Vol 31, Num 11, pp 1129-1308, issn 0361-5235, 180 p.Conference Proceedings

Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn-8Zn-3Bi solder on OSP-Cu substrateASIT KUMAR GAIN; LIANGCHI ZHANG.Journal of alloys and compounds. 2014, Vol 617, pp 779-786, issn 0925-8388, 8 p.Article

Characters of multicomponent lead-free soldersZHAO, N; LIU, X. Y; HUANG, M. L et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 10, pp 3925-3931, issn 0957-4522, 7 p.Article

Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloysXIE, H. X; JIANG, L; CHAWLA, N et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 9, pp 3456-3466, issn 0957-4522, 11 p.Article

Influence of Cr alloying on the oxidation resistance of Sn―8Zn―3Bi soldersNA HUANG; ANMIN HU; MING LI et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 8, pp 2812-2817, issn 0957-4522, 6 p.Article

Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints : Lead-free solder and packagingCUIPING WU; JUN SHEN; CHANGFEI PENG et al.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 1, pp 14-21, issn 0957-4522, 8 p.Article

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders : Lead-free solder and packagingYOON, Jeong-Won; LEE, Jong-Gun; LEE, Jong-Bum et al.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 1, pp 41-47, issn 0957-4522, 7 p.Article

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal AgingPOWERS, Mike; PAN, Jianbiao; SILK, Julie et al.Journal of electronic materials. 2012, Vol 41, Num 2, pp 224-231, issn 0361-5235, 8 p.Article

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder JointsANDERSON, Iver E; BOESENBERG, Adam; HARRINGA, Joel et al.Journal of electronic materials. 2012, Vol 41, Num 2, pp 390-397, issn 0361-5235, 8 p.Article

On the absence of the β to α Sn allotropic transformation in solder joints made from paste and metal powderDI MAIO, D; HUNT, C.Microelectronic engineering. 2011, Vol 88, Num 1, pp 117-120, issn 0167-9317, 4 p.Article

A novel method of reducing melting temperatures in SnAg and SnCu solder alloysCHUKKA, Rami N; TELU, Suresh; NRMR, Bhargava et al.Journal of materials science. Materials in electronics. 2011, Vol 22, Num 3, pp 281-285, issn 0957-4522, 5 p.Article

Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interfaceWANG, X; LIU, Y. C; GAO, Z. M et al.Journal of materials science. Materials in electronics. 2011, Vol 22, Num 1, pp 14-19, issn 0957-4522, 6 p.Article

Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder JointsCHUANG, Tung-Han; WU, Hsing-Fei.Journal of electronic materials. 2011, Vol 40, Num 1, pp 71-77, issn 0361-5235, 7 p.Article

Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni SoldersVENTURA, Tina; CHO, Young-Hee; KONG, Chun et al.Journal of electronic materials. 2011, Vol 40, Num 6, pp 1403-1408, issn 0361-5235, 6 p.Article

Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V CouplesCHEN, Sinn-Wen; LIN, Yu-Ren; WU, Hsin-Jay et al.Journal of electronic materials. 2011, Vol 40, Num 7, pp 1527-1532, issn 0361-5235, 6 p.Article

Shear deformation behavior of a Sn―3Ag―0.5Cu single solder ball at intermediate strain ratesJOO, Se-Min; KIM, Ho-Kyung.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2011, Vol 528, Num 6, pp 2711-2717, issn 0921-5093, 7 p.Article

Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solderHUI WANG; SONGBAI XUE; FENG ZHAO et al.Journal of materials science. Materials in electronics. 2010, Vol 21, Num 2, pp 111-119, issn 0957-4522, 9 p.Article

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder AlloysHIDAKA, N; WATANABE, H; YOSHIBA, M et al.Journal of electronic materials. 2009, Vol 38, Num 5, pp 670-677, issn 0361-5235, 8 p.Article

Effects of Ga-Ag, Ga-Al and Al-Ag additions on the wetting characteristics of Sn-9Zn-X-Y lead-free soldersHUI WANG; SONGBAI XUE; WENXUE CHEN et al.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 12, pp 1239-1246, issn 0957-4522, 8 p.Article

Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During ReflowCHEN, Hsiao-Yun; CHIH CHEN.Journal of electronic materials. 2009, Vol 38, Num 2, pp 338-344, issn 0361-5235, 7 p.Article

Microstructural evolution of ε-AgZn₃ and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatmentHSUAN, Teng-Chun; LIN, Kwang-Lung.Journal of alloys and compounds. 2009, Vol 469, Num 1-2, pp 350-356, issn 0925-8388, 7 p.Article

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) AdditionMENG LIU; XIAN, Ai-Ping.Journal of electronic materials. 2009, Vol 38, Num 11, pp 2353-2361, issn 0361-5235, 9 p.Article